Wide molybdenum target

    

    High-purity molybdenum target is one of the key raw materials in the production of AMOLED panels. The company's new product is an ultra-wide, high-purity, high-density molybdenum planar sputtering target for TFT-LCD/AMOLED, mainly used in G2.5-G6 generation. TFT-LCD/AMOLED fills the gap of domestic wide-format molybdenum target (1800mm), which has an important impact on the company's future market expansion and performance growth.

   The requirements for sputtering targets are higher than those of traditional materials. General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size and defect control; higher requirements or special requirements Requirements include: surface roughness, resistance, grain size uniformity, composition and tissue uniformity, foreign matter (oxide) content and size, magnetic permeability, ultra-high density and ultra-fine grains. Magnetron sputtering coating is a new type of physical vapor deposition method, which uses an electron gun system to emit and focus electrons on the material to be plated, so that the sputtered atoms follow the momentum conversion principle to remove the material with higher kinetic energy. Fly to the substrate to deposit a film. This plated material is called a sputtering target. The sputtering target has a metal, an alloy, a ceramic compound, and the like.

    Magnetron sputtering coating is a new type of physical vapor deposition coating, which has obvious advantages in many aspects compared to the evaporation coating method. As a relatively mature technology that has been developed, magnetron sputtering has been applied in many fields.


Sputtering technology

Sputtering is one of the main techniques for preparing thin film materials. It uses ions generated by an ion source to accelerate and aggregate in a vacuum to form a high-speed energy ion beam, bombarding a solid surface, and kinetic energy exchange between ions and solid surface atoms. The atoms on the solid surface are separated from the solid and deposited on the surface of the substrate. The bombarded solid is a raw material for preparing a deposited film by sputtering, which is called a sputtering target. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, solar photovoltaics, recording media, flat displays, and surface coatings of workpieces.

Main application
Sputtering targets are mainly used in electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devices, etc.; they can also be used in the field of glass coating; they can also be applied to wear-resistant materials, high temperature corrosion resistance. , decorative items and other industries


Classification

    According to the shape, it can be divided into square targets, round targets, and shaped targets.
    According to the composition, it can be divided into metal target, alloy target, and ceramic compound target.
    According to different applications, it is divided into semiconductor-related ceramic targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets, giant magnetoresistance ceramic targets, etc.

    According to the application field, it is divided into microelectronic target, magnetic recording target, optical disk target, precious metal target, thin film resistive target, conductive film target, surface modified target, mask layer target, decorative layer target, Electrode target, package target, other target
    Magnetron sputtering principle: an orthogonal magnetic field and an electric field are applied between the sputtered target (cathode) and the anode, and the required inert gas (usually Ar gas) is charged in the high vacuum chamber, and the magnet is in the target material. The surface forms a magnetic field of 250 to 350 Gauss and forms an orthogonal electromagnetic field with the high voltage electric field. Under the action of electric field, Ar gas is ionized into positive ions and electrons, and a certain negative high voltage is applied to the target. The electrons emitted from the target are affected by the magnetic field and the ionization probability of the working gas increases, forming a high-density plasma near the cathode. Body, Ar ion accelerates to the target surface under the action of Lorentz force, bombards the target surface at a high speed, so that the sputtered atoms on the target follow the momentum conversion principle and fly away from the target surface with higher kinetic energy. The substrate is deposited into a film. Magnetron sputtering is generally divided into two types: branch sputtering and RF sputtering. The principle of the branch sputtering equipment is simple, and the rate is also fast when sputtering metal. The use of RF sputtering is more extensive. In addition to sputterable conductive materials, non-conductive materials can be sputtered. At the same time, reactive sputtering is used to prepare compound materials such as oxides, nitrides and carbides. If the frequency of the radio frequency is increased, it becomes microwave plasma sputtering, and electron cyclotron resonance (ECR) type microwave plasma sputtering is commonly used.

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